ASUS TUF Gaming AMD Ryzen AI 9 HX 370 AI up to 81 TOPs |16GB RAM|1TB SSD |14 inch 2.5K 165Hz |RTX4050 6GB|WIN 11|AR-EN Backlit Key |Gray

ASUS TUF Gaming AMD Ryzen AI 9 HX 370 AI up to 81 TOPs |16GB RAM|1TB SSD |14 inch 2.5K 165Hz |RTX4050 6GB|WIN 11|AR-EN Backlit Key |Gray

Brand: ASUS

Model Name: ASUS TUF Gaming

Screen Size: 14 Inches

Colour: Gray

Hard Disk Size: 1 TB

CPU Model: Ryzen 9

Installed RAM Memory Size: 16 GB

Operating System: Windows 11

Special Features: Thin

Graphics Card Description: Dedicated

Despite being the most compact TUF Gaming laptop ever, the A14 boasts some seriously impressive specs for serious Windows 11 gaming. Featuring up to an AMD Ryzen AI 9 HX 370 processor and up to an NVIDIA GeForce RTX 4050 Laptop GPU

The design philosophy behind the TUF Gaming A14 is all about blending power with portability. As the smallest TUF Gaming laptop we’ve ever built, the A14 easily slips into bags, backpacks, and even some large purses, giving you the flexibility to take more essentials, and at just 1.46kg, it’s light enough to carry around all day.

Keep up with the pros thanks to a 2.5K 165Hz display. NVIDIA G-SYNC synchronizes the display's refresh rate with the GPU's output to reduce lag, minimize stuttering, and eliminate visual tearing for ultra-smooth and lifelike gameplay. The 2.5K panel hits 100% of the sRGB color space,

Powerful components require powerful cooling, and the TUF Gaming A14 is capable of 110W in Turbo mode. So we equipped the machine with a whole suite of technology to keep it running at peak performance. The keyboard has been redesigned to increase airflow and reduce surface temperatures, and when paired with ultra-thin heatsink fins and 89-blade fans, the A14 will be running at peak performance for years to come.

The dual fans come with 89 ultra-thin blades, just 0.1mm thick, enabling high airflow and static pressure without bothersome acoustics or whine. Not all air needs to be sent to the copper heatsinks. The fan shrouds have precisely calculated cutouts to direct airflow toward internal components like memory and VRM modules, keeping them cooler and operating at peak efficiency. The A14’s thermal energy is dissipated by two heatsinks, each lined with ultra-thin copper fins as slim as 0.1 mm. Higher density fins allow for increased heat dissipation and lower air resistance for smoother flow.